Description
There is potential for memory corruption in the RIL daemon due to de reference of memory outside the allocated array length in RIL in Snapdragon Auto, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Mobile, Snapdragon Wearables in versions MDM9206, MDM9607, MDM9635M, MDM9650, MSM8909W, SD 210/SD 212/SD 205, SD 425, SD 427, SD 430, SD 435, SD 439 / SD 429, SD 450, SD 625, SD 636, SD 650/52, SD 675, SD 712 / SD 710 / SD 670, SD 820A, SD 835, SD 845 / SD 850, SD 855, SDM439, SDM630, SDM660, ZZ_QCS605.
No summary for this CVE yet.
CVSS Vector Breakdown
Exploitability
AV:LAttack VectorLocal
AC:LAttack ComplexityLow
PR:LPrivileges RequiredLow
UI:NUser InteractionNone
Scope
S:UScopeUnchanged
Impact
C:HConfidentialityHigh
I:HIntegrityHigh
A:HAvailabilityHigh
Weaknesses
Affected Products
qualcomm
commercial·USaka qualcomm, inc., qualcomm incorporated, qualcomm inc
and 24 more affected products View all →
Exploitability
Official Patch Available
Attack Graph
Products CVE Techniques Tactics
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MITRE ATT&CK
2 techniques Initial Access
Privilege Escalation
References
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